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Schobertechnologies to showcase cutting and converting technologies at PACK EXPO

The company will highlight rotary cutting, creasing, punching and stacking technologies for packaging applications in in Chicago.

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By: Steve Katz

Associate Editor, Label & Narrow Web

Schobertechnologies will showcase its latest rotary cutting and converting technologies at PACK EXPO International 2026, taking place October 18-21 in Chicago, IL.

At Booth W-40022, the company will highlight equipment and components for cutting, creasing, punching and stacking, including its SPC inline modules and converting lines for the production of liquid packaging blanks and rollstock.

The SPC technology is designed for register-accurate creasing, perforating and diecutting at operating speeds up to 800 m/min and working widths up to 1,800mm. The system also incorporates removal of punching waste.

Schobertechnologies will also feature cutting and creasing cylinders with a segmented design. Depending on the material being converted, segments are available in several steel types, while anvil cylinders can be supplied with chrome or TopCoat finishes.

Also highlighted will be a punching module with an integrated slitter for producing rounded corners on tea tags and bags. The system performs the length cut immediately after punching to maintain alignment of the punching profile.

For creasing applications, Schobertechnologies offers a module with a quick-lift device and wedge adjustment for controlling crease depth. The system can use solid or segmented creasing cylinders, while magnetic cylinders with exchangeable creasing plates are available for medium and shorter production runs.

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